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benefits of micro precision technologies for high aspect ratio products in datacenters

Jan 6, 2026 9:53:40 AM By Clare Lamb

Part of IDEX Materials Science Solutions group, Veco B.V. and Tecan Ltd bring together pioneering micro precision technologies – from electroforming to chemical etching to laser machining and beyond. Where appropriate, we can leverage these technologies to help manufacturers overcome specific and complex design challenges to achieve remarkable levels of detail and quality in the production of components, ensuring optimal performance and functionality.

This approach not only enhances the capabilities of core processes but also opens up new possibilities for creating intricate and high-performance components. The combination of these technologies paves the way for innovative solutions in manufacturing, offering increased precision and efficiency in producing mission-critical parts for a wide range of industries

Specifically, electroforming and chemical etching are both advanced manufacturing techniques that excel in producing high aspect ratio components, which are increasingly important for datacenter applications e.g., heat exchangers, EMI shielding and microfluidic cooling systems.

benefits of electroforming for high aspect ratio components

Electroforming is a process where metal is deposited onto a mandrel using electroplating, then separated to create precise, thin-walled structures.

  • Extreme Precision & Complexity
    Can achieve very fine features and tolerances down to 1 micron, ideal for intricate cooling channels or microstructures.
  • Excellent Surface Finish
    Smooth surfaces reduce turbulence in liquid cooling systems, improving thermal efficiency.
  • Material Versatility
    Works well with copper, nickel and nickel alloys, which have high thermal conductivity and corrosion resistance—perfect for datacenter environments.
  • High Aspect Ratio Capability
    Can produce components with deep cavities and thin walls without distortion, cost efficiency due to parallel production
  • Scalability for Thin Structures
    Ideal for lightweight yet strong parts, reducing overall system weight and improving energy efficiency.

Our electroforming process ensures:

benefits of chemical etching for high aspect ratio components

Chemical etching (or photochemical machining) uses controlled chemical reactions to remove material and create patterns.

  • No Mechanical Stress
    Unlike stamping or machining, etching doesn’t introduce stress, preserving dimensional accuracy.
  • Design Flexibility
    Complex geometries, fine apertures, and intricate patterns can be produced without expensive tooling.
  • Cost-Effective for Prototypes & Volume
    digital tooling offers lower setup costs and faster turnaround times for agile product development in micro precision manufacturing
  • High Repeatability
    Excellent for producing consistent, high-density features across large batches.
  • Compatible with Multiple Metals
    Works with stainless steel, copper, and other alloys commonly used in datacenter cooling and shielding.

 

why this matters for datacenters

  • Thermal Management: High aspect ratio microchannels improve liquid cooling efficiency, critical for high-performance servers.
  • Signal Integrity & Shielding: Precision apertures and thin structures help reduce electromagnetic interference.
  • Space Optimization: Lightweight, compact designs allow for higher rack density without compromising airflow or cooling.

 

products Veco and Tecan can provide include

  • Microchannel Heat Exchangers
    Ultra-thin, high aspect ratio channels for liquid cooling in high-density servers.
  • Microfluidic Plates
    For advanced cooling systems using dielectric fluids.
  • Precision EMI/RFI Shielding Components
    Complex 3D shields for sensitive electronics.
  • High-Performance Filters
    For airflow and liquid filtration with micron-level accuracy.
  • EMI/RFI Shielding Sheets
    Thin, patterned metal sheets for signal integrity.
  • Thermal Spreaders
    Copper or aluminum sheets etched for optimized heat dissipation.
  • Connector & Contact Components
    Fine apertures for electrical interconnects.
  • Ventilation Grilles
    Lightweight, precise airflow control panels.

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