In the fast-evolving world of semiconductors, precision is everything. As devices shrink and performance demands grow, manufacturers face increasing pressure to deliver components that are not only ultra-precise but also scalable, reliable, and cost-effective. That’s where Veco’s electroforming technology comes in.
Electroforming is a high-precision additive manufacturing process that builds metal parts atom by atom using electrodeposition. Unlike traditional machining or etching, electroforming allows for the creation of complex microstructures with sub-micron accuracy, making it ideal for the semiconductor industry.
Veco has been a global leader in electroforming for decades, delivering custom solutions to some of the most demanding sectors—including semiconductors.
Veco’s electroforming process can achieve tolerances down to ±0.5 micron or even less, enabling the production of parts with extremely fine features. This is critical for semiconductor applications like wafer testing, MEMS, and microfluidics, where even the smallest deviation can impact performance.
Electroforming supports 2D and 2.5D designs, allowing for intricate geometries that are difficult or impossible to achieve with conventional methods. Veco’s proprietary tooling and process control make it possible to manufacture parts with high aspect ratios, sharp edges, and smooth surfaces—perfect for advanced semiconductor components.
Whether you need a single prototype or millions of parts, Veco’s electroforming process is scalable without compromising quality. The repeatability of the process ensures consistent performance across batches, supporting the semiconductor industry’s need for high-volume, high-reliability production.
Electroforming is a tool-less process, which means lower setup costs and faster turnaround times. Veco’s ability to rapidly iterate designs without retooling makes it ideal for R&D and agile product development in semiconductor manufacturing.
Veco offers specialised materials like Ni-H2Q, which provide superior thermal and mechanical stability (up to 400ºC). These materials are essential for semiconductor testing environments, where components must withstand extreme conditions without degradation.
applications include:
Veco’s electroformed parts are used in a wide range of semiconductor applications, including:
Each part is custom-engineered to meet the exact specifications of the client, ensuring optimal performance and integration.
With decades of experience, cutting-edge facilities, and a commitment to innovation, Veco is the trusted partner for semiconductor manufacturers worldwide. Our electroforming technology delivers the precision, flexibility, and reliability needed to stay ahead in a competitive market.
stronger together
Veco offers a diverse range of precision components designed to contribute to the efficiency and longevity of components to support the semiconductor industry.
With electroforming at our core, we bring together micro precision technologies – from chemical etching and laser cutting from our sister company, Tecan and beyond to help manufacturers overcome complex design challenges and achieve remarkable levels of detail and quality in the production of components, ensuring optimal performance and functionality.
This approach not only enhances the capabilities of core processes but also opens up new possibilities for creating intricate and high-performance components. The combination of these technologies paves the way for innovative solutions in manufacturing, offering increased precision and efficiency in producing mission-critical parts for a wide range of industries.